Resistive memory device

ABSTRACT

A system having a memory cell. In certain embodiments, the memory cell includes a resistive memory element, an access transistor having a gate, a first terminal, and a second terminal, and a control transistor having a gate, a first terminal, and a second terminal. The first terminal of the access transistor may be coupled to the resistive memory element, and the gate of the access transistor may be coupled to the gate of the control transistor. Additionally, the first terminal of the control transistor may be coupled to the resistive memory element.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of U.S. patent application Ser. No.11/501,598, which was filed on Aug. 9, 2006.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to electronic devices, and, morespecifically, to resistive memory devices.

2. Description of the Related Art

This section is intended to introduce the reader to various aspects ofart that may be related to various aspects of the present invention,which are described and/or claimed below. This discussion is believed tobe helpful in providing the reader with background information tofacilitate a better understanding of the various aspects of the presentinvention. Accordingly, it should be understood that these statementsare to be read in this light, and not as admissions of prior art.

Generally, resistive memory devices manipulate and sense the resistanceof a memory element. Typically, the memory element is capable ofassuming two or more resistance states, e.g., high resistance and lowresistance. To store data, the memory element is driven to one of theresistive states. Then, to read the data, the resistance of the memoryelement is sensed. For example, in a binary system, a low resistance maycorrespond to a value of zero, and a high resistance may correspond to avalue of one. Binary data stored in a resistive memory element istypically read by sensing if the resistance of the element is greaterthan or less than a threshold resistance. During a read operation, thesensed resistance is compared to the threshold resistance, and theresistive memory device outputs a one or a zero based on the comparison.Thus, the resistance of the resistive memory element indicates thecontent of stored data.

The resistance of the memory element is typically measured indirectly.Resistive memory devices often read data by measuring a transientresponse of a sensing circuit that includes the memory element.Generally, a stimulus, such as a sudden change in voltage, is applied tothe sensing circuit, and, after a waiting period, a parameter, such as avoltage at some node, is sensed. Depending on the electrical state ofthe sensing circuit after the waiting period, the resistive memorydevice may output a zero or a one. For example, in some sensingcircuits, a low-resistance state may result in a rapid increase in thevoltage of the sensed node, and a high-resistance state may result in aslow increase in the voltage. In these sensing circuits, the voltagesensed immediately after the waiting period indicates the resistance ofthe memory element and the value of the stored data, e.g., a low voltageindicates a slow response and a high resistance, and a high voltageindicates a fast response and a low resistance. That is, the resistanceof the memory element affects the speed of the sensing circuit, and thespeed of the sensing circuit indicates the value of the stored data.

Unfortunately, read operations may take a long time. Memory elementsstoring a given logic value may have a large distribution ofresistances. For instance, some memory elements storing a zero or a onemay have a resistance that is close to the threshold resistance. In manysensing circuits, small differences in resistance take a relatively longtime to discernibly affect the sensed parameter during read operations.Circuit designers often design for a worst-case scenario, so the waitingperiods are typically relatively long to discern resistances that areclose to the threshold resistance. In other words, circuit designers mayincrease the waiting period to measure accurate resistance states, assome resistances may be close to the threshold resistance. Consequently,read operations may be relatively slow in some resistive memory devices.

BRIEF DESCRIPTION OF THE DRAWINGS

Advantages of the invention may become apparent upon reading thefollowing detailed description and upon reference to the drawings, inwhich:

FIG. 1 illustrates a block diagram of an exemplary processor-basedsystem in accordance with an embodiment of the present invention;

FIG. 2 illustrates an exemplary memory sub-system that may employ aresistive memory device in accordance with an embodiment of the presentinvention;

FIG. 3 illustrates an exemplary memory module that may employ aresistive memory device in accordance with an embodiment of the presentinvention;

FIG. 4 illustrates a partial schematic diagram of an exemplary array ofmemory cells in accordance with an embodiment of the present invention;

FIGS. 5 and 6 are schematic diagrams of a memory cell from the array ofFIG. 4 illustrating the majority current flow during an exemplary readoperation in accordance with an embodiment of the present invention;

FIG. 7 is a graph depicting exemplary voltage traces from the readoperations of FIGS. 5 and 6 in accordance with an embodiment of thepresent invention;

FIG. 8 is a schematic diagram of a memory cell from the array of FIG. 4illustrating the current flow during an exemplary write operation inaccordance with an embodiment of the present invention; and

FIG. 9 illustrates a partial schematic diagram of another exemplaryarray of memory cells in accordance with an alternate embodiment of thepresent invention.

DETAILED DESCRIPTION OF SPECIFIC EMBODIMENTS

One or more specific embodiments of the present invention will bedescribed below. In an effort to provide a concise description of theseembodiments, not all features of an actual implementation are describedin the specification. It should be appreciated that in the developmentof any such actual implementation, as in any engineering or designproject, numerous implementation-specific decisions must be made toachieve the developers' specific goals, such as compliance withsystem-related and business-related constraints, which may vary from oneimplementation to another. Moreover, it should be appreciated that sucha development effort might be complex and time consuming but wouldnevertheless be a routine undertaking of design, fabrication, andmanufacture for those of ordinary skill having the benefit of thisdisclosure.

Some of the subsequently discussed embodiments include circuits that mayrapidly indicate the resistance of a memory element. In some of theseembodiments, even resistances close to the threshold resistance maydiscernibly affect a sensed parameter after a short waiting period, asis explained further below. That is, some of the circuits discussedherein may be highly sensitive to resistances close to the thresholdresistance. To this end, during certain read operations, a sensedvoltage may be pulled up or down, in opposite directions, from astarting value, depending whether the resistance of the memory elementis above or below the threshold resistance. As explained below, suchembodiments may facilitate relatively short waiting periods. Thefollowing discussion describes exemplary devices in accordance withembodiments of the present techniques. However, prior to addressingthese embodiments from the device perspective, exemplary systems inaccordance with embodiments of the present techniques are described.

Turning to the figures, FIG. 1 depicts an exemplary processor-basedsystem, generally designated by reference numeral 10. As is explainedbelow, the system 10 may include various electronic devices manufacturedin accordance with embodiments of the present technique. The system 10may be any of a variety of types such as a computer, pager, cellularphone, personal organizer, control circuit, etc. In a typicalprocessor-based system, one or more processors 12, such as amicroprocessor, control the processing of system functions and requestsin the system 10. As is explained below, the processor 12 and othersubcomponents of the system 10 may include resistive memory devicesmanufactured in accordance with embodiments of the present technique.

The system 10 typically includes a power supply 14. For instance, if thesystem 10 is a portable system, the power supply 14 may advantageouslyinclude a fuel cell, a power scavenging device, permanent batteries,replaceable batteries, and/or rechargeable batteries. The power supply14 may also include an AC adapter, so the system 10 may be plugged intoa wall outlet, for instance. The power supply 14 may also include a DCadapter such that the system 10 may be plugged into a vehicle cigarettelighter, for instance.

Various other devices may be coupled to the processor 12 depending onthe functions that the system 10 performs. For instance, a userinterface 16 may be coupled to the processor 12. The user interface 16may include buttons, switches, a keyboard, a light pen, a mouse, adigitizer and stylus, and/or a voice recognition system, for instance. Adisplay 18 may also be coupled to the processor 12. The display 18 mayinclude an LCD, an SED display, a CRT display, a DLP display, a plasmadisplay, an OLED display, LEDs, and/or an audio display, for example.Furthermore, an RF sub-system/baseband processor 20 may also be coupledto the processor 12. The RF sub-system/baseband processor 20 may includean antenna that is coupled to an RF receiver and to an RF transmitter(not shown). One or more communication ports 22 may also be coupled tothe processor 12. The communication port 22 may be adapted to be coupledto one or more peripheral devices 24 such as a modem, a printer, acomputer, or to a network, such as a local area network, remote areanetwork, intranet, or the Internet, for instance.

The processor 12 generally controls the system 10 by implementingsoftware programs stored in the memory. The software programs mayinclude an operating system, database software, drafting software, wordprocessing software, and/or video, photo, or sound editing software, forexample. The memory is operably coupled to the processor 12 to store andfacilitate execution of various programs. For instance, the processor 12may be coupled to the system memory 26, which may include resistiverandom access memory (RRAM), dynamic random access memory (DRAM), and/orstatic random access memory (SRAM). The system memory 26 may includevolatile memory, non-volatile memory, or a combination thereof. Thesystem memory 26 is typically large so that it can store dynamicallyloaded applications and data. In some embodiments, the system memory 26may include resistive memory devices, such as those discussed furtherbelow.

The processor 12 may also be coupled to non-volatile memory 28, which isnot to suggest that system memory 26 is necessarily volatile. Thenon-volatile memory 28 may include a read-only memory (ROM), such as anEPROM, resistive read-only memory (RROM), and/or flash memory to be usedin conjunction with the system memory 26. The size of the ROM istypically selected to be just large enough to store any necessaryoperating system, application programs, and fixed data. Additionally,the non-volatile memory 28 may include a high capacity memory such as atape or disk drive memory, such as a hybrid-drive including resistivememory or other types of non-volatile solid-state memory, for instance.As is explained in greater detail below, the non-volatile memory 28 mayinclude resistive memory devices manufactured in accordance withembodiments of the present technique.

FIG. 2 generally illustrates a block diagram of a portion of a memorysub-system, which may include all or portions of the system memory 26 orthe non-volatile memory 28. A memory controller 30 is generally providedto facilitate access to storage devices in the system memory 26 ornon-volatile memory 28. The memory controller 30 may receive requests toaccess the storage devices via one or more processors, such as theprocessor 12, via peripheral devices, such as the peripheral device 24,and/or via other systems (not shown). The memory controller 30 isgenerally tasked with facilitating the execution of the requests to thememory devices and coordinating the exchange of information, includingconfiguration information, to and from the memory devices.

The memory sub-system may include a plurality of slots 32-46. Each slot32-46 is configured to operably couple a memory module, such as adual-inline memory module (DIMM), to the memory controller 30 via one ormore memory buses. Each DIMM generally includes a plurality of memorydevices such as non-volatile (or volatile) RRAM, dynamic random accessmemory (DRAM), or a combination thereof. Each illustrated DIMM has anumber of memory devices on each side of the module. Each side of themodule may be referred to as a “rank.” Accordingly, each exemplary slot32-46 is configured to receive a single DIMM having two ranks. Forinstance, the slot 32 is configured to receive a DIMM having ranks 32Aand 32B, the slot 34 is configured to receive a DIMM having ranks 34Aand 34B, and so forth. In the present exemplary embodiment, each of theeight memory slots 32-46 is capable of supporting a module comprisingeight individual memory devices on each rank 32A/B-46A/B, as bestillustrated with respect to FIG. 3, described further below.

Referring again to FIG. 2, the memory buses may include a memory databus 48 to facilitate the exchange of data between each memory device onthe DIMMs and the memory controller 30. The memory data bus 48 comprisesa plurality of single bit data buses, or transmission lines, eachcoupled from the memory controller 30 to a memory device. In someembodiments of the system memory 26 or non-volatile memory 28, thememory data bus 48 may include 64 individual data buses. Further, thememory data bus 48 may include one or more individual buses to eachmemory rank 32A/B-46A/B which may be used for ECC error detection andcorrection. As can be appreciated by those skilled in the art, theindividual buses of the memory data bus 48 will vary depending on theconfiguration and capabilities of the system 10.

The system memory 26 or non-volatile memory 28 may also includes acommand bus 50 on which address information such as command address(CA), row address select (RAS#), column address select (CAS#), writeenable (WE#), bank address (BA), chip select (CS#), clock enable (CKE),and on-die termination (ODT), for example, may be delivered for acorresponding request. Further, the command bus 50 may also be used tofacilitate the exchange of configuration information at boot-up. As withthe memory data bus 48, the command bus 50 may comprise a plurality ofindividual command buses. In the present embodiment, the command bus 50may include 20 individual buses. As previously described with referenceto the memory data bus 48, a variety of embodiments may be implementedfor the command bus 50 depending on the system configuration.

FIG. 3 illustrates an exemplary memory module 52, such as a DIMM, thatmay be inserted into one of the memory slots 32-46 (FIG. 2). In thepresent exemplary views, one side of the memory module 52 isillustrated, and generally designated as the rank 52A. As previouslydiscussed, the memory module 52 may include two ranks 52A and 52B. Therank 52A includes a plurality of memory devices 56A-56H, such as dynamicrandom access memory (DRAM) devices or resistive random access memory(RRAM), which may be used for storing information. As will beappreciated, the second, opposing side of the memory module 52 (52B, notshown) also may include a number of memory devices. The memory module 52may include an edge connector 54 to facilitate mechanical coupling ofthe memory module 52 into one of the memory slots 32-46. Further, theedge connector 54 provides a mechanism for electrical coupling tofacilitate the exchange of data and control signals from the memorycontroller 30 to the memory devices 56A-56H (and the memory devices onthe second ranks). The embodiment of FIG. 3 may be employed inaccordance with various standards. For instance, the memory module 52may be employed in a single data rate (SDR), fully buffered (FB)-DIMM,double data rate (DDR), and double data rate 2 (DDR2) system 10.

The memory devices 56A-56H may each include an array of cells that arecapable of storing one or more bits of data. For example, someembodiments may include an array of cells having resistive memoryelements and circuitry for reading the data stored in the resistivememory elements. As described further below, certain embodiments mayinclude an array of cells that facilitate short waiting periods duringread operations and high-speed operation of the memory device.

FIG. 4 illustrates an exemplary array 58 of resistive memory cells(hereinafter “cells”) 60. A grid of digit lines DL1 and DL2, word linesWL1 and WL2, and top plates TP1 and TP2 crisscross the array 58. In someembodiments, the top plates TP1 and TP2 are a single plate rather than aseries of lines. The illustrated cells 60 are each connected to thedigit lines DL1 or DL2 and the exemplary word lines WL1 or WL2, whichmay be generally perpendicular to the digit lines DL1 and DL2.Additionally, the illustrated cells 60 are each connected to the topplate TP1 or TP2. Sense amps 62 and 64 are coupled to the digit linesDL1 and DL2, respectively. The sense amps 62 and 64 may be capable ofsensing voltages less than 100, 80, 50, 40, 30, 20, 10, or 5 millivolts,or less, for example. Each of the digit lines DL1 and DL2 may have acapacitance C, which may be a parasitic capacitance and/or a capacitorcoupled to the digit lines DL1 and DL2. In the illustrated embodiment,the array 58 is not a cross-point memory array.

Each of the illustrated cells 60 may feature a resistive memory element66, an access transistor 68, and a control transistor 70. The resistivememory element 66 may include a top electrode, a bottom electrode, and avariable resistance material. In some embodiments, the top electrode maybe disposed above the bottom electrode, and the variable resistancematerial may be disposed in series between the top electrode and thebottom electrode. Of course, in other embodiments, the top electrode andbottom electrode may be oriented differently, such as side-by-side orreversed, for example. In some embodiments, the top electrode may be atop plate, and the bottom electrode may contact the variable resistancematerial in a relatively small contact area, such as less than 50,000square nanometers, 10,000 square nanometers, 5,000 square nanometers,1,000 square nanometers, 500 square nanometers, 100 square nanometers,50 square nanometers, 10 square nanometers, or less, for example. Asexplained further below with reference to FIG. 8, in certainembodiments, large programming currents passing through the variableresistance material may change the resistance of the material during awrite operation. The small contact area may concentrate programmingcurrents and lower power consumption in some embodiments. Alternatively,or additionally, other embodiments may include other structures that areused to change resistance of the variable resistance material, such as aheating element, for instance.

The variable resistance material may include phase-change memorymaterials, e.g., GeTe, In—Se, Sb2Te3, GaSb, InSb, As—Te, Al—Te,Ge—Sb—Te, Te—Ge—As, In—Sb—Te, Te—Sn—Se, Ge—Se—Ga, Bi—Se—Sb, Ga—Se—Te,Sn—Sb—Te, In—Sb—Ge, Te—Ge—Sb—S, Te—Ge—Sn—O, Te—Ge—Sn—Au, Pd—Te—Ge—Sn,In—Se—Ti—Co, Ge—Sb—Te—Pd, Ge—Sb—Te—Co, Sb—Te—Bi—Se, Ag—In—Sb—Te,Ge—Sb—Se—Te, Ge—Sn—Sb—Te, Ge—Te—Sn—Ni, Ge—Te—Sn—Pd, Ge—Te—Sn—Pt, and/orvarious other chalcogenide alloys. Alternatively, or additionally, theresistive memory element 66 may include other variable resistancematerials, such as colossal magnet resistive films, for example, a PCMOfilm (e.g., Pr0.7Cr0.3MoO3 or Ba0.6Sr0.4TiO3); oxidation films havingPerovskite structure, for example, doped or undoped BaTiO3, SrTiO3;and/or an oxidation film, for example, NbO5, TiO2, TaO5 and NiO, Cu2O.In some embodiments, the resistive memory element 66 has a generallyhomogenous composition of a single variable resistance material. Inother embodiments, the resistive memory element 66 may include acombination of one or more of the above-listed variable resistancematerials or other materials.

The resistive memory element 66 may have two or more resistance statesor resistances (Rpm). For example, a binary resistive memory element 66may have an upper resistance and a lower resistance. In someembodiments, the upper resistance may be one, two, three, four, or moreorders of magnitude larger than the lower resistance. Other embodimentsmay include a resistive memory element 66 with finer graduations ofresistance, such as an 4, 8, 16, 32, 64, or more categories ofresistance. Indeed, some embodiments may include an analog resistivememory element 66. In certain embodiments, the resistance states may begenerally non-volatile, i.e., stable in the absence of a power source.

The access transistor 68 and control transistor 70 may includemetal-oxide-semiconductor (MOS) field effect transistors (FETs). In someembodiments, the access transistor 68 and control transistor 70 areFinFETs, for example FinFETS that are formed with a double-pitch and/orcross-hair process. Alternatively, or additionally, the accesstransistor 68 and/or the control transistor 70 may be formed with othersub-photolithographic and/or self-aligned processes. As describedfurther below, the on-state resistance (hereinafter “resistance”) of theaccess transistor 68 and/or the control transistor 70 may be selectedbased on the threshold resistance of the resistive memory element 66.For instance, the resistance of the access transistor 68, the controltransistor 70, or both may be between a lower resistance of theresistive memory element 66 and an upper resistance of the resistivememory element 66. In some embodiments, the resistance of the accesstransistor 68, the control transistor 70, or both may be between asubstantial portion or substantially all of a lower resistancedistribution of resistive memory elements 66 and a substantial portionor substantially all of an upper resistance distribution of resistivememory elements 66. In certain embodiments, the resistance of the accesstransistor may be generally equal to the threshold resistance, whichdivides the low resistance state from the high resistance state. Ingeneral, the control transistor has a lower resistance than the accesstransistor.

In the present embodiment, the gate of the access transistor 68 and thegate of the control transistor 70 connect or couple to the word linesWL1 or WL2. Similarly, one terminal of the access transistor 68, such asa source or a drain, and one terminal of the control transistor 70 mayconnect to the resistive memory element 66, for example, to the bottomelectrode of the resistive memory element 66. The other terminal of theaccess transistor 68 may be grounded, and the other terminal of thecontrol transistor 70 may be connected to the digit line DL1 or DL2.

FIGS. 5-7 illustrate exemplary read operations. Specifically, FIG. 5depicts the flow of majority current j through the cell 60 when theresistive memory element 66 has a high resistance, and FIG. 6 depictsthe flow of majority current j when the resistive memory element 66 hasa low resistance. FIG. 7 depicts exemplary voltage traces of the digitline DL during the exemplary read operations of FIGS. 5 and 6. However,prior to discussing these exemplary read operations in detail, theinitial electrical state of the cell 60 is described.

In both the high resistance case of FIG. 5 and the low resistance caseof FIG. 6, the majority current j may be affected by a startingcondition of the cell 60. Prior to the presently discussed readoperations, the top plate TP may be at voltage V_(TP), the digit line DLmay be at voltage ½ V_(TP), and the word line WL may be near ground.Grounding the word line WL may maintain the access transistor 68 andcontrol transistor 70 in an off or de-energized state. Of course, otherembodiments may include access transistors 68 and/or control transistors70 that conduct current when their respective gates are grounded, inwhich case the word line WL may be in an energized state prior to a readoperation. In some embodiments, the voltage of the digit line DL may besome other fraction, or multiple, of the voltage of the top plate TP,such as approximately 20%, 30%, 40%, 60%, 70%, 80%, 90%, 150%, or 250%of the voltage of the top plate TP, for example. In some embodiments,the starting voltage of the digit line DL may be generally equal to athreshold voltage of the sense amp 62, i.e., the voltage at which thesense amp 62 transitions from latching a voltage corresponding to a highlogic value to a voltage corresponding to a low logic value. Asdiscussed below, the transient response of the cell 60 from this orother starting conditions may facilitate relatively fast and accuratesensing of the resistance of the resistive memory element 66.

The present read operations begin by energizing the word line WL. As theword line WL is energized, the access transistor 68 and controltransistor 70 may turn on and conduct current j. In the high resistancecase depicted by FIG. 5, at least initially, the majority current j mayflow from the digit line DL, which is initially at one-half of V_(TP),to ground, thereby lowering the voltage of the digit line DL. In FIG. 5,the majority current j flows through the control transistor 70 and theaccess transistor 68, and current flowing through the resistive memoryelement 66 is minimal due to its high resistance state. The initial,transient response of the cell 60 may be dominated by the majoritycurrent j flowing from the digit line DL to ground. As a result, in thepresent embodiment, the voltage of the digit line DL may initially dropfrom ½ V_(TP).

After a relatively short waiting period t, the voltage of the digit lineDL may be sensed by the sense amp 62 or 64. The duration of the waitingperiod t may be a function of the sensitively of the sense amp 62 or 64(FIG. 4). As depicted by FIG. 7, a drop in the digit line DL voltage attime t may indicate a high resistance state, thereby conveying the datastored in the resistive memory element 66 to the sense amp 62 or 64.

In the low resistance case depicted by FIG. 6, the majority current jmay flow in the other direction, to the digit line DL from the top plateTP. With the resistance of the resistive memory element 66 R_(pm)relatively low, the initial transient response of the cell 60 may bedominated by the current j flowing through the resistive memory element66, while current flowing though the access transistor 68 may berelatively small due to its larger resistance compared to the controltransistor 70 and the resistive memory element 66. The voltage of thetop plate V_(TP) may be maintained at a generally constant or elevatedlevel by a power supply coupled to the top plate TP. As illustrated byFIG. 7, due to the direction of current j, the voltage of the digit linemay increase over time.

After waiting period t, the sense amp 62 or 64 may sense the increase involtage of the digit line. A voltage above the starting voltage of thedigit line DL at time t may indicate a low resistance state of theresistive memory element 66 and convey data that corresponds to a lowresistance state.

Advantageously, in the present embodiment, waiting period t may berelatively short. In the present embodiment, the voltage of the digitline DL, which is sensed by the sense amp 62 or 64, is pulled up or downfrom the starting voltage ½ V_(TP) based on the resistive state of theresistive memory element 66. Resistances below the threshold resistancemay tend to pull the voltage of the digit line DL up, and resistancesabove the threshold resistance may tend to pull the voltage of the digitline DL down. Thus, in the present embodiment, the sensed parameter,i.e., the voltage of the digit line DL, may quickly and discerniblyindicate the stored resistance state after a short waiting period t.Beneficially, the relatively short waiting period t may facilitate highspeed operation of some resistive memory devices.

The present read operations may be generally described by the followingdifferential equation, in which C is the capacitance of the digit lineDL, Vs is the voltage of the digit line DL, t is time, Ra is theresistance of the access transistor 68, Rc is the resistance of thecontrol transistor 70, and R_(p) is the resistance of the resistivememory element 66, and V_(TP) is the voltage of the top plate TP:

C*dVs/dt*(Rp*Rc+Rp*Ra+Ra*Rc)=−Vs*(Rp+Ra)+V _(TP) *Ra

Assuming the constant values in the equation above are properlyselected, the waiting period t may be relatively short. For example, ifthe low resistance distribution of Rp generally falls between Rc/10 andRc, the high resistance distribution is generally larger than 100*Rc,V_(TP) is about 1 volt, Ra is about 4*Rc, and the sense amp 62 or 64 issensitive to voltages of approximately 50 millivolts, the sense amp maybe fired after the digit line is pulled far enough to cover thesensitivity of the sense amp, which is calculated as t=Rc*C. That is, insome embodiments, the waiting period t may be as low as Rc*C secondsunder these conditions. In contrast, certain other techniques thatemploy a single access transistor per cell have a waiting period that isgreater than the product of the capacitance C and the total resistanceof the access transistor Ra and the resistance of resistive elementR_(P) because of delays while the digit line is pulled to the referencevoltage plus the sensitivity of the sense amp to fire the sense amp. Thewait time is calculated as 1.8*R_(C)*1 if the memory elements have thesame properties and the access transistor resistance is 0.8 R_(C), whichis the total resistance of R_(C) and 4 R_(c) in parallel. In otherwords, under the present assumptions, the waiting period t of thepresent embodiment may be one half of the waiting period employed inother sensing techniques.

Further, in embodiments having a more sensitive sense amp 62 or 64, thewaiting period may be even shorter. For example, in the presentembodiment, if the sense amp 62 or 64 sensitivity is increased to 20millivolts, the waiting period may be reduced to t=Rc*C/2.5.Advantageously, in some embodiments, the duration of the waiting periodt may be reduced by increasing the sensitivity of the sense amp 62 or64.

FIG. 8 illustrates an exemplary write operation. During a writeoperation, the digit line DL may be grounded, and the gate of the accesstransistor 68 and the gate of the control transistor 70 may be energizedby the word line WL. A relatively large programming current j may flowthrough the resistive memory element 66 via both the access transistor68 and the control transistor 70, driving a phase change of a resistivememory material. In some embodiments, a short, high programming currentj may result in a high resistance state, and a lower, longer programmingcurrent j may result in a low resistance state. In certain embodiments,the low resistance state may correspond with a portion of the resistivememory material being relatively ordered or crystalline, and the highresistance state may correspond with the portion of the resistive memorymaterial being relatively disordered or amorphous. The voltage of thetop plate V_(TP) may be elevated in some embodiments to drive theprogramming current.

Advantageously, conducting the programming current j through both theaccess transistor 68 and the control transistor 70 may tend to reducethe current loads supported by either transistor 68 or 70. In someembodiments, smaller transistors 68 and 70 may conduct the reducedprogramming currents, thereby facilitating greater device integration.

FIG. 9 depicts another exemplary array 72 of cells 74. In the presentembodiment, the cells 74 may have an access resistor Ra coupled to anaccess line AL1 or AL2. The access lines AL1 and AL2 may each couple toa terminal, such as a source or a drain, of a shared access transistor68. The other terminal of the shared access transistor 68 may couple toground. The gate of the shared access transistor 68 may couple to theword lines WL1 or WL2. In the present embodiment, the resistance of theaccess transistor 68 and the access lines AL1 and AL2 may be smallrelative to Ra. During operation, the exemplary array 72 may behavesimilarly to the array 58.

While the invention may be susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, it should be understood that the invention is not intended tobe limited to the particular forms disclosed. Rather, the invention isto cover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the followingappended claims.

1. A system, comprising: a voltage divider circuit comprising: aresistive memory element; a first transistor; and a second transistor,wherein the first and second transistor are coupled to the resistivememory element.
 2. The system of claim 1, wherein at least a portion ofthe resistive memory element is configured to change from a generallycrystalline structure to a generally amorphous structure in response toa programming current.
 3. The system of claim 1, wherein the resistivememory element comprises a chalcogenide alloy.
 4. The system of claim 1,comprising a first voltage source coupled to the resistive memoryelement, wherein a voltage across the memory element at the start of aread operation is determined by a resistance ratio of the resistivememory element and the second transistor.
 5. The system of claim 4,wherein the first voltage source comprises a top plate.
 6. The system ofclaim 1, wherein a terminal of the second transistor couples to aterminal of the first transistor and the resistive memory element. 7.The system of claim 1, wherein the second transistor is a field effecttransistor.
 8. The system of claim 1, comprising a sense amplifiercoupled to the voltage divider circuit, wherein the sense amplifier isconfigured to sense a transient response of the voltage divider circuit.9. The system of claim 1, comprising a computer, a processor, anoperating system, an input device, a power supply, a peripheral device,volatile memory, non-volatile memory, a display, a memory module, or acombination thereof.
 10. A device, comprising: a wordline; a digit line;a conductor; a voltage-divider circuit connected in series between theconductor and the digit line, wherein the voltage-divider circuitcomprises: a resistive memory element; and a first transistor connectedto both the resistive memory element and the wordline.
 11. The device ofclaim 10, wherein the conductor is a plate connected to a plurality ofdigit lines through a plurality of voltage-divider circuits.
 12. Thedevice of claim 10, wherein the conductor is a line connected to thedigit line through a plurality of voltage-divider circuits.
 13. Thedevice of claim 10, wherein a gate of the first transistor is connectedto the wordline.
 14. The device of claim 10, wherein the firsttransistor is connected through one terminal to the digit line andthrough another terminal to the resistive memory element.
 15. The deviceof claim 10, wherein the resistive memory element is connected in seriesbetween the conductor and the first transistor.
 16. The device of claim10, wherein the voltage-divider circuit comprises a second transistor,and wherein a gate of the second transistor is connected to both thewordline and the gate of the first transistor.
 17. The device of claim16, wherein the terminal of the second transistor is connected to groundand another terminal of the second transistor is connected to both theresistive memory element and a terminal of the first transistor.
 18. Amethod, comprising: conducting a current through a resistive memoryelement; if a resistance of the resistive memory element is less than athreshold value, then conducting a portion of the current to a firstconductor; if the resistance of the resistive element is greater thanthe threshold value, then supplementing the current with another currentfrom the first conductor.
 19. The method of claim 18, wherein conductingthe current through the resistive memory element comprises conductingthe current through a phase-change memory material.
 20. The method ofclaim 18, comprising charging the conductor before conducting a currentthrough the resistive memory element.
 21. The method of claim 18,comprising sensing whether the voltage of the conductor is rising orfalling.
 22. A device, comprising: an array of memory cells, whereineach memory cell in the array comprises: an access device; a controldevice; and a resistive memory element.
 23. The device of claim 22,wherein the access device comprises a first transistor and the controldevice comprises a second transistor.
 24. The device of claim 23,wherein channels of the first transistor and the second transistor areconnected in parallel to the resistive memory element.
 25. The device ofclaim 23, wherein one of the first transistor and the second transistoris connected to a sense amplifier and the other transistor among thefirst transistor and the second transistor is connected to ground.